Fast thermal analysis of hybrid integrated circuits

The research concept presented is based on a program for theoretically defining and solving the thermal model exchange of hybrid integrated circuits (HICs) and experimentally verifying the results. The overall thermal distribution in the steady state is determined by the solution of a system of homogeneous partial differential equations by the method of separation of variables. The temperature distribution on the ceramic surface induced by several sources is determined from the superposition principle. Fast thermal analysis of the HIC gives the overall temperature distribution on the substrate surface. Verification is carried out by remote-sensing temperature measurement of the HIC surface. The calculated results and the results of measurements show significant agreement.