DocumentCode
387
Title
Shield can mounting clip design for robust and enhanced shielding effectiveness in mobile devices
Author
Eakhwan Song ; Park, Hyun Ho
Author_Institution
Global Production Technol. Centre, Samsung Electron., Suwon, South Korea
Volume
50
Issue
4
fYear
2014
fDate
February 13 2014
Firstpage
318
Lastpage
320
Abstract
A small metallic shield enclosure, commonly called a shield can, is an indispensable component of modern mobile devices in reducing electromagnetic interference. A sophisticated clip design utilising an embossing technique and a furrow structure for mounting shield cans on printed circuit boards in mobile devices is proposed in order to enhance the robustness and effectiveness of the shield cans. The proposed design is validated by radiated spurious emission measurement and three-dimensional field simulation.
Keywords
electromagnetic interference; electromagnetic shielding; embossing; interference suppression; printed circuits; smart phones; 3D field simulation; electromagnetic interference; embossing technique; furrow structure; metallic shield enclosure; mobile devices; printed circuit boards; radiated spurious emission measurement; shield can mounting clip design; shielding effectiveness;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el.2013.4024
Filename
6746305
Link To Document