DocumentCode :
387
Title :
Shield can mounting clip design for robust and enhanced shielding effectiveness in mobile devices
Author :
Eakhwan Song ; Park, Hyun Ho
Author_Institution :
Global Production Technol. Centre, Samsung Electron., Suwon, South Korea
Volume :
50
Issue :
4
fYear :
2014
fDate :
February 13 2014
Firstpage :
318
Lastpage :
320
Abstract :
A small metallic shield enclosure, commonly called a shield can, is an indispensable component of modern mobile devices in reducing electromagnetic interference. A sophisticated clip design utilising an embossing technique and a furrow structure for mounting shield cans on printed circuit boards in mobile devices is proposed in order to enhance the robustness and effectiveness of the shield cans. The proposed design is validated by radiated spurious emission measurement and three-dimensional field simulation.
Keywords :
electromagnetic interference; electromagnetic shielding; embossing; interference suppression; printed circuits; smart phones; 3D field simulation; electromagnetic interference; embossing technique; furrow structure; metallic shield enclosure; mobile devices; printed circuit boards; radiated spurious emission measurement; shield can mounting clip design; shielding effectiveness;
fLanguage :
English
Journal_Title :
Electronics Letters
Publisher :
iet
ISSN :
0013-5194
Type :
jour
DOI :
10.1049/el.2013.4024
Filename :
6746305
Link To Document :
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