DocumentCode :
3870
Title :
Modeling Local Via Structures Using Innovative PEEC Formulation Based on Cavity Green´s Functions With Wave Port Excitation
Author :
Hanfeng Wang ; Jun Fan
Author_Institution :
Electromagn. Compatibility (EMC) Lab., Missouri Univ. of Sci. & Technol., Rolla, MO, USA
Volume :
61
Issue :
5
fYear :
2013
fDate :
May-13
Firstpage :
1748
Lastpage :
1757
Abstract :
Complex via structures such as noncircular antipads are rigorously studied, in the local region close to vias, using an innovative partial-element equivalent-circuit (PEEC) formulation based on the cavity Green´s functions. The problem under study is an essential building block that can be used to model complex multilayer structures. With the usage of the cavity Green´s functions, the number of unknowns is significantly reduced. Further, nonorthogonal quadrilateral mesh is used to better accommodate the complex shape of the antipads in practical designs. A novel wave port excitation method is proposed, which is new for the PEEC formulations. Singularity extraction in self element calculations involving the nonorthogonal cell and the cavity Green´s functions is studied. The impedance parameters of several via structures are obtained using the proposed method, and the results are validated with the finite-element solution from a commercial tool.
Keywords :
Green´s function methods; equivalent circuits; finite element analysis; vias; PEEC formulation; cavity Green´s functions; complex multilayer structures; complex via structures; finite-element solution; impedance parameters; local region; local via structures; noncircular antipads; nonorthogonal cell; nonorthogonal quadrilateral mesh; partial-element equivalent-circuit formulation; self element calculations; singularity extraction; wave port excitation; Cavity Green´s functions; complex via structure; partial-element equivalent-circuit (PEEC) formulation; shared antipad; singularity extraction; wave port excitation;
fLanguage :
English
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9480
Type :
jour
DOI :
10.1109/TMTT.2013.2253791
Filename :
6491502
Link To Document :
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