DocumentCode :
38766
Title :
A Petri-Net-Based Scheduling Strategy for Dual-Arm Cluster Tools With Wafer Revisiting
Author :
NaiQi Wu ; Mengchu Zhou ; Feng Chu ; Chengbin Chu
Author_Institution :
Dept. of Ind. Eng., Guangdong Univ. of Technol., Guangzhou, China
Volume :
43
Issue :
5
fYear :
2013
fDate :
Sept. 2013
Firstpage :
1182
Lastpage :
1194
Abstract :
There are wafer fabrication processes in cluster tools that require wafer revisiting. The adoption of a swap strategy for such tools forms a 3-wafer cyclic (3-WC) period with three wafers completed in each period. It has been shown that, by such a scheduling strategy, the minimal cycle time cannot be reached for some cases. This raises a question of whether there is a scheduling method such that the performance can be improved. To answer this question, a dual-arm cluster tool with wafer revisiting is modeled by a Petri net. Based on the model, the dynamical behavior of the process is analyzed. Then, a 2-wafer cyclic (2-WC) scheduling strategy is revealed for the first time. Cycle time analysis is conducted for the proposed strategy to evaluate its performance. It shows that, for some cases, the performance obtained by a 2-WC schedule is better than that obtained by any existing 3-WC ones. Thus, they can be used to complement each other in scheduling dual-arm cluster tools with wafer revisiting. Illustrative examples are given.
Keywords :
Petri nets; scheduling; semiconductor technology; statistical analysis; wafer-scale integration; 2-WC scheduling method; 2-wafer cyclic scheduling strategy; 3-wafer cyclic period; Petri-net-based scheduling strategy; cycle time analysis; dual-arm cluster tool scheduling method; dynamical behavior; swap strategy; wafer fabrication process; wafer revisiting; Color; Job shop scheduling; Load modeling; Robots; Schedules; Semiconductor device modeling; System recovery; Cluster tool; Petri nets (PNs); scheduling; semiconductor manufacturing;
fLanguage :
English
Journal_Title :
Systems, Man, and Cybernetics: Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
2168-2216
Type :
jour
DOI :
10.1109/TSMCA.2012.2230440
Filename :
6425515
Link To Document :
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