DocumentCode
389140
Title
Application of lead frames of semiconductor devices in microwave hybrid IC technology
Author
Iovdalsky, V.A. ; Pchelin, V.A. ; Morgunov, V.G. ; Chernobrivets, I.N.
fYear
2001
fDate
14-14 Sept. 2001
Firstpage
460
Lastpage
461
Abstract
The advantages of the beam-lead lead-frame technology application to provide the connection between the semiconductor devices and the microstrip lines of the PCB are given. The distinctive features of the lead-frame fabrication technology and the HIC assembly using the frames are also pointed out.
Keywords
beam-lead devices; hybrid integrated circuits; integrated circuit technology; microwave integrated circuits; PCB; beam-lead lead-frame fabrication technology; microstrip line; microwave hybrid IC; semiconductor device;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave and Telecommunication Technology, 2001. CriMiCo 2001. 11th International Conference on
Conference_Location
Sevastopol, Crimea, Ukraine
Print_ISBN
966-7968-00-6
Type
conf
Filename
1173931
Link To Document