DocumentCode
389872
Title
Study on aging property of hydrophobic epoxy system for outdoor insulation
Author
Urabe, S. ; Yoshihara, S. ; Shirakashi, T. ; Hotoda, Y.
Author_Institution
Dept. of Energy & Environ. Sci., Utsunomiya Univ., Japan
Volume
3
fYear
2002
fDate
6-10 Oct. 2002
Firstpage
2181
Abstract
Hydrophobic epoxy resin system for outdoor insulation was tested various endurance tests: high energy Xenon weathering test; ozone aging test; and acid rain test. After that, evaluated surface micro-formation by SEM observation, surface roughness, contact-angle, and tracking-resistance and erosion-resistance property at electric discharge. They compared hydrophobic epoxy resin system with conventional cycloaliphatic epoxy resin system for outdoor application. Surface micro-formation, surface roughness, and contact-angle of hydrophobic and conventional epoxy systems were not changed after ozone aging test and acid rain test from the original condition. However at high energy Xenon weathering test, these properties were changed. Contact-angle of conventional cycloaliphatic epoxy system was declined, but contact-angle of hydrophobic epoxy system increased with test progress. In IEC tracking tests, it was confirmed that the tracking and erosion-resistance of hydrophobic epoxy system was better than the conventional cycloaliphatic epoxy system.
Keywords
ageing; epoxy insulation; insulation testing; surface discharges; surface topography; IEC tracking test; SEM observation; acid rain test; aging property; contact-angle; cycloaliphatic epoxy system; electric discharge; endurance tests; erosion-resistance property; high energy Xenon weathering test; hydrophobic epoxy outdoor insulation; insulation breakdown testing; ozone aging test; surface micro-formation; surface roughness; tracking; tracking-resistance; Aging; Epoxy resins; Insulation life; Insulation testing; Rain; Rough surfaces; Surface discharges; Surface roughness; System testing; Xenon;
fLanguage
English
Publisher
ieee
Conference_Titel
Transmission and Distribution Conference and Exhibition 2002: Asia Pacific. IEEE/PES
Print_ISBN
0-7803-7525-4
Type
conf
DOI
10.1109/TDC.2002.1177801
Filename
1177801
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