DocumentCode :
391550
Title :
Serial test interface: a novel architecture for self-tests of ASICs
Author :
Kokrady, Aman A. ; Khanna, David
Author_Institution :
Res. Center, Texas Instruments, Bangalore, India
fYear :
2002
fDate :
10-12 Dec. 2002
Firstpage :
184
Lastpage :
188
Abstract :
The manufacturing cost per transistor has decreased exponentially for the last decade. The test cost however, has been decreasing at a much slower rate and now occupies a major portion in total cost of an application specific integrated circuit (ASIC). Recent advances with VLSI technology now enable microprocessors and ASICs to be packaged into fine pitch, high count packages, posing numerous testing challenges. In this paper a generic test interface for testing IP-modules within an ASIC is presented. This eliminates the need for customizing testing modules. The proposed architecture is also shown to test multiple IP-modules within an ASIC. The paper further shows the possibility of testing selected IP-modules within an ASIC. Addition of a single design enables testing of all modules within the chip. The test interface is common to all digital ASICs and packages itself on the outside of the ASIC to form boundary scan architecture. This module is called serial test interface. Five new pins are added for user interface to enable testing. The serial test interface is designed to test all kinds of IP-modules simultaneously bypassing desired IP-modules in the test mode. The paper presents an alternative approach to IEEE 1149.1 in implementing boundary scan. The simplicity of the design presented in the paper makes this idea novel.
Keywords :
application specific integrated circuits; boundary scan testing; built-in self test; fine-pitch technology; integrated circuit testing; ASIC; ASICs; IEEE 1149.1; VLSI; boundary scan architecture; fine pitch packages; multiple IP modules; self-tests; serial test interface; test cost; user interface; Application specific integrated circuits; Automatic testing; Built-in self-test; Circuit testing; Costs; Integrated circuit packaging; Integrated circuit testing; Manufacturing; Transistors; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 2002. 4th
Print_ISBN :
0-7803-7435-5
Type :
conf
DOI :
10.1109/EPTC.2002.1185665
Filename :
1185665
Link To Document :
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