Title :
Effects of process variation on signal integrity for high speed differential signaling on package level
Author :
Ahn, Seungyoung ; Lu, Albert Chee W ; Fan, Wei ; Wai, Lai L. ; Kim, Joungho
Author_Institution :
Terahertz Interconnection & Package Lab., Korea Adv. Inst. of Sci. & Technol., South Korea
Abstract :
This paper presents the effects of the manufacturing process variation on the signal integrity of differential interconnects on package level structure. We have shown that the variation of the manufacturing process has a critical impact on the signal integrity of the differential lines, which results in significant distortion of the transmitted waveform. We have conducted full wave simulation, circuit simulation based on equations, and measurement using TDR system to investigate the relationship between process variation and signal integrity with electrical characteristic parameter analysis.
Keywords :
circuit simulation; network parameters; packaging; TDR system; circuit simulation; electrical characteristic parameter analysis; full wave simulation; high speed differential signaling; manufacturing process variation; package level; package level structure; process variation; signal integrity; transmitted waveform; Analytical models; Circuit simulation; Distortion measurement; Electric variables; Electric variables measurement; Equations; Integrated circuit interconnections; Manufacturing processes; Packaging; Signal processing;
Conference_Titel :
Electronics Packaging Technology Conference, 2002. 4th
Print_ISBN :
0-7803-7435-5
DOI :
10.1109/EPTC.2002.1185676
