Title :
Three dimensional finite element simulation of wire looping process in wirebonding
Author :
Ng, B.H. ; Tay, A.A.O. ; Ong, S.H.
Author_Institution :
Center for IC Failure Anal. & Reliability, Nat. Univ. of Singapore, Singapore
Abstract :
This paper describes a fully three-dimensional finite element simulation of the wirelooping process in ball-wedge wirebonding. The three-dimensional geometry of the wirebonder capillary is utilised and the free interaction between the capillary and the wire simulated. The effect of wire-tensioning is studied and the "kick up" effect of the wedge bonding process was simulated. Good agreement between simulated and actual wirebond profiles is obtained.
Keywords :
digital simulation; electronic engineering computing; finite element analysis; lead bonding; packaging; 3D finite element simulation; ABAQUS ver 6.1; FEA software; ball-wedge wirebonding; kick up effect; three-dimensional geometry; wedge bonding process; wire looping process; wire tensioning; Analytical models; Bonding; Computational modeling; Computer simulation; Fingers; Finite element methods; Gold; Probes; Solid modeling; Wire;
Conference_Titel :
Electronics Packaging Technology Conference, 2002. 4th
Print_ISBN :
0-7803-7435-5
DOI :
10.1109/EPTC.2002.1185693
