Effects of gallium on wettability, microstructures and mechanical properties of the Sn-Zn-Ag-Ga and Sn-Zn-Ag-Al-Ga solder alloys

Author

Chen, Kang-I ; Lin, Kwang-Lung

Author_Institution

Dept. of Electron. & Inf., Tung-Fang Inst. of Technol., Kaohsiung, Taiwan

fYear

2002

fDate

4-6 Dec. 2002

Firstpage

49

Lastpage

54

Abstract

The microstructures and mechanical properties of Sn-8.55Zn-0.5 Ag-0.45Al -yGa (wt %) and wetting behavior of Sn-8.55Zn-0.5Ag-yGa (wt %) lead-free solders were investigated. The Ga content, y, of the solders investigated were 0.5 wt % ∼3.0 wt %. The results indicate that Ga plays an important role not only in the structure and wetting behavior, but also in the mechanical properties. The mechanical properties and DSC behavior were compared with that of 63Sn-37Pb and Sn-9Zn solders. Ga lowers the melting point of the Sn-8.55Zn-0.5Ag-0.45Al-yGa solders. The Sn-8.55Zn-0.5Ag-0.45Al-0.5Ga solders exhibit greater strength and better ductility than the 63Sn-37Pb.

Keywords

differential scanning calorimetry; ductility; mechanical strength; melting point; soldering; wetting; DSC behavior; Sn-Zn-Ag-Al-Ga; Sn-Zn-Ag-Ga; ductility; mechanical properties; melting point; microstructures; solder alloys; strength; wettability; Aluminum alloys; Copper; Environmentally friendly manufacturing techniques; Gallium alloys; Lead; Mechanical factors; Microstructure; Soldering; Temperature; Zinc;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on

Print_ISBN

0-7803-7682-X

Type

conf

DOI

10.1109/EMAP.2002.1188812

Filename

1188812