DocumentCode

392418

Title

Reliability of the SnBi lead finished Pb-free produet

Author

Park, Ki-Hwan ; Kim, Nam-Seog ; Oh, Se-Yong

Author_Institution

Samsung Electronics Co. LTD.

fYear

2002

fDate

4-6 Dec. 2002

Firstpage

150

Lastpage

156

Keywords

Belts; Bismuth; Current density; Electronics packaging; Lead; Morphology; Size control; Temperature control; Tin; Weight control;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on

Print_ISBN

0-7803-7682-X

Type

conf

DOI

10.1109/EMAP.2002.1188829

Filename

1188829