Title :
Microstructural features and vibration fracture behavior of Sn-Zn-Ag solder alloys
Author :
Song, J.M. ; Lan, G.F. ; Lui, T.S. ; Chen, L.H.
Author_Institution :
Dept. of Mater. Sci. & Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Abstract :
Mechanical properties of a potential lead-free solder, Sn-9Zn-xAg (x=0.5∼3.5 wt%), are examined in this study, particularly the vibration fatigue behavior. Results show that striated deformation of Sn-rich dendrites contributes to a greater damping capacity and thus the specimens with higher Ag content possessed a higher vibration life when suffering vibration with a constant vibration force. With respect to vibration under a fixed initial deflection amplitude, all the specimens had a similar vibration fracture resistance under low strain amplitude conditions, while high Ag specimens had a higher vibration cycles to failure under high strain conditions. This was closely related to the striated deformation along the main crack.
Keywords :
damping; dendritic structure; eutectic alloys; fatigue cracks; fracture toughness; silver alloys; soldering; tin alloys; vibrations; zinc alloys; Sn-Zn-Ag; Sn-Zn-Ag eutectic alloy; crack growth; damping capacity; dendrite deformation; lead-free solder; mechanical properties; microstructural properties; striated deformation; vibration fracture resistance; Capacitive sensors; Damping; Environmentally friendly manufacturing techniques; Lead; Materials science and technology; Mechanical factors; Resonance; Testing; Tin alloys; Vibration measurement;
Conference_Titel :
Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on
Print_ISBN :
0-7803-7682-X
DOI :
10.1109/EMAP.2002.1188850