DocumentCode
392427
Title
Thick-film hybrid microwave filters made in PolyTherm CVD diamond substrates
Author
Gondek, J. ; Kordowiak, S. ; Habdank, T. ; Kocol, J.
Author_Institution
Private Inst. of Electron. Eng., Krakow, Poland
fYear
2002
fDate
4-6 Dec. 2002
Firstpage
386
Lastpage
390
Abstract
The realisation of microwave integrated circuits consisting of numerous elements and components, both passive and active, takes place in steps. Initially, experimental constituent elements are designed and constructed, and only after it is found that they satisfy the operating conditions, can they be integrated into a sub-system. As a result of this we obtain complicated Microwave Integrated Circuits (MICs). Initially however one has to construct basic MIC elements such as: resonators, filters, couplings, Y branch joints, circulators, etc. During research over several years carried out at the Private Institute of Electronic Engineering and Cracow University of Technology, Academy of Mining and Metallurgy and Technical School of Communication and devoted to the application of thick-film technology to MIC, the authors have devised and constructed several microwave elements using strip-lines and this paper reports of the results of their studies. The construction of the filters involved the use of a new type of dielectric material with high constructions were produced by the use of thick-film technology and gold pastes manufactured by Du Ponte. An interesting means of compiling the extreme resonators with the strip-line was employed. PolyTherm ET 100 CVD diamond substrates, were used. Examples of filter construction and their frequency characteristics are given.
Keywords
CVD coatings; diamond; hybrid integrated circuits; microwave filters; microwave integrated circuits; resonator filters; strip line filters; strip line resonators; thick film circuits; Au; C; PolyTherm CVD diamond substrate; dielectric material; gold paste; microwave integrated circuit; strip-line resonator; thick-film hybrid microwave filter; Circulators; Coupling circuits; Dielectric materials; Gold; Integrated circuit technology; Microwave communication; Microwave filters; Microwave integrated circuits; Microwave technology; Resonator filters;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on
Print_ISBN
0-7803-7682-X
Type
conf
DOI
10.1109/EMAP.2002.1188870
Filename
1188870
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