High resolution long array thermal ink jet printhead fabricated by anisotropic wet etching and deep Si RIE

Author

Nayve, R. ; Fujii, M. ; Fukugawa, A. ; Murata, M.

Author_Institution

Ink Jet Bus. Group, Fuji Xerox Co. Ltd., Kanagawa, Japan

fYear

2003

fDate

19-23 Jan. 2003

Firstpage

456

Lastpage

461

Abstract

A thermal ink jet (TIJ) printhead suitable for high speed and high quality printing has been developed. The printhead has been fabricated by dicing the bonded wafer, which consists of a bubble generating heater plate and a Si channel plate. The Si channel plate consists of an ink chamber and an ink inlet formed by KOH etching, and a nozzle formed by ICP RIE. The nozzle formed by ICP RIE has squeezed structures, which contribute to high-energy efficiency of drop ejector and therefore successful ejection of small ink drop. These two wafers are directly bonded by using electrostatic bonding of full-cured polyimide to Si. With these technologies, we have fabricated a 1" long printhead with 832 nozzles having 800 dots per inch (dpi) resolution and a 4 pl. ink drop volume.

Keywords

etching; ink jet printers; micromachining; silicon; sputter etching; 1 in; ICP RIE; KOH; KOH etching; Si; Si channel plate; anisotropic wet etching; bonded wafer; bubble generating heater plate; deep Si RIE; drop ejector; electrostatic bonding; high quality printing; high resolution long array thermal ink jet printhead; high speed printing; small ink drop; Anisotropic magnetoresistance; Fabrication; Ink jet printing; Large scale integration; Plasma applications; Plasma temperature; Polyimides; Semiconductor films; Wafer bonding; Wet etching;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE The Sixteenth Annual International Conference on

ISSN

1084-6999

Print_ISBN

0-7803-7744-3

Type

conf

DOI

10.1109/MEMSYS.2003.1189785

Filename

1189785