Title :
APIVT-grown silicon thin layers and PV devices
Author :
Wang, T.H. ; Ciszek, T.F. ; Page, M.R. ; Bauer, R.E. ; Wang, Q. ; Landry, M.D.
Author_Institution :
Nat. Renewable Energy Lab., Golden, CO, USA
Abstract :
Large-grained (5-20 μm) polycrystalline silicon layers have been grown at intermediate temperatures of 750°-950°C directly on foreign substrates without a seeding layer by iodine vapor transport at atmospheric pressure with rates as high as 3 μm/min. A model is constructed to explain the atypical temperature dependence of growth rate. We have also used this technique to grow high-quality epitaxial layers on heavily doped CZ-Si and on upgraded MG-Si substrates. Possible solar cell structures of thin-layer polycrystalline silicon on foreign substrates with light trapping have been examined, compared, and optimized by two-dimensional device simulations. The effects of grain boundary recombination on device performance are presented for two grain sizes of 2 and 20 μm. We found that 104 cm/s recombination velocity is adequate for 20-μm grain-sized thin silicon, whereas a very low recombination velocity of 103 cm/s must be accomplished in order to achieve reasonable performance for a 2-μm grain-sized polycrystalline silicon device.
Keywords :
elemental semiconductors; grain boundaries; grain size; semiconductor device measurement; semiconductor device models; semiconductor epitaxial layers; semiconductor growth; silicon; solar cells; 2 micron; 20 micron; 5 to 20 micron; 750 to 950 degC; APIVT-grown silicon thin layers; PV devices; Si; grain boundary recombination; grain size; iodine vapor transport; large-grained polycrystalline silicon layers; solar cell structures; temperature dependence; Grain boundaries; Grain size; Inductors; Passivation; Photovoltaic cells; Radiative recombination; Renewable energy resources; Silicon devices; Substrates; Temperature;
Conference_Titel :
Photovoltaic Specialists Conference, 2002. Conference Record of the Twenty-Ninth IEEE
Print_ISBN :
0-7803-7471-1
DOI :
10.1109/PVSC.2002.1190464