Title :
Wide-gap thin film Si n-i-p solar cells deposited by hot-wire CVD
Author :
Qi Wang ; Iwaniczko, Eyene ; Yang, Jeffrey ; Lord, Kenneth ; Guha, Subhendu ; Wang, Keda ; Daxing Han
Author_Institution :
Nat. Renewable Energy Lab., Golden, CO, USA
Abstract :
High-voltage wide bandgap thin-film Si n-i-p solar cells have been made using the hot-wire chemical vapor deposition (HWCVD) technique. The best open-circuit voltage (Voc) has exceeded 0.94 V in solar cells using HWCVD in the entire n-i-p structure. A Voc of 0.97 V has been achieved using HWCVD in the n and i layers and plasma-enhanced (PE) CVD for the p layer. The high voltages are attributed to the wide-gap i layer and an improved p/i interface. The wide-gap i layer is obtained by using low substrate temperatures and sufficient hydrogen dilution during the growth of the i layer to arrive at the amorphous-to-microcrystalline phase transition region. The optical band gap (Eo4) of the i layer is found to be 1.90 eV. These high-voltage cells also exhibit good fill factors exceeding 0.7 with short-circuit-current densities of 8 to 10 mA/cm2 on bare stainless steel substrates. We have also carried out photoluminescence (PL) spectroscopy studies and found a correlation between Voc and the PL peak energy position.
Keywords :
CVD coatings; elemental semiconductors; energy gap; optical constants; photoluminescence; plasma CVD coatings; semiconductor device measurement; semiconductor thin films; silicon; solar cells; wide band gap semiconductors; 0.94 V; HWCVD; Si; amorphous-to-microcrystalline phase transition region; fill factors; hot-wire CVD; open-circuit voltage; optical band gap; p/i interface; photoluminescence; plasma-enhanced CVD; short-circuit-current density; stainless steel substrate; wide-gap thin film Si n-i-p solar cells; Chemical vapor deposition; Hydrogen; Optical films; Photonic band gap; Photovoltaic cells; Plasma temperature; Semiconductor thin films; Sputtering; Substrates; Voltage;
Conference_Titel :
Photovoltaic Specialists Conference, 2002. Conference Record of the Twenty-Ninth IEEE
Print_ISBN :
0-7803-7471-1
DOI :
10.1109/PVSC.2002.1190828