Prototyping with fine pitch and BGA SMT in oceanic engineering

Author

McBride, Lance R.

Author_Institution

Monterey Bay Aquarium Res. Inst., Moss Landing, CA, USA

Volume

3

fYear

2002

fDate

29-31 Oct. 2002

Firstpage

1741

Abstract

Applying surface mount technology (SMT) to oceanic devices opens the door for future oceanic technology. The difficulty of designing with and maintaining SMT instruments forces many designers to pursue more favorable choices, but a collection of techniques and tools allows designers to develop SMT designs from the start. This paper should serve as a guideline for a device development process that extends the capabilities of instrumentation through the use of these SMT devices.

Keywords

ball grid arrays; capacitors; field programmable gate arrays; fine-pitch technology; low-power electronics; oceanographic techniques; resistors; surface mount technology; 0.80 mm; 1.00 mm; 1.27 mm; 1.50 mm; BGA attachment quality; FPGA; ball grid array; bent leads; ceramic chip capacitors; chip resistors; connectors; debugging tool; design tools; device development process; electromagnetic compatibility; electrostatic discharge; fine pitch; instrumentation; logic voltage compatibility; metric quad flat pack; oceanic devices; oceanic engineering; oceanic technology; pin grid array; printed circuit board; programmable parts; prototyping; sockets; soldering; surface mount technology; Electronics packaging; Geometry; Lead; Oceanic engineering and marine technology; Prototypes; Resistors; Soldering; Surface-mount technology; Wafer bonding; Wires;

fLanguage

English

Publisher

ieee

Conference_Titel

OCEANS '02 MTS/IEEE

Print_ISBN

0-7803-7534-3

Type

conf

DOI

10.1109/OCEANS.2002.1191897

Filename

1191897