• DocumentCode
    393200
  • Title

    The characterization of SAW coupling factor from paired IDT insertion loss measurements

  • Author

    Hickernell, Fred S.

  • Author_Institution
    Central Florida Univ., Orlando, FL, USA
  • Volume
    1
  • fYear
    2002
  • fDate
    8-11 Oct. 2002
  • Firstpage
    231
  • Abstract
    The extent to which the measured transmission insertion loss between paired identical unapodized IDTs can be correlated to the coupling factor of a piezoelectric substrate or piezo-film layer is considered in this paper. The paired transducer insertion loss of standard and rotated cuts of commonly used piezoelectric substrates with coupling factors in the range from 0.000 1 to 0.1 were measured using a harmonic rich split finger IDT. The network analyzer measurements were made in a test fixture having a 50-ohm connection in close proximity to the transducer electrodes. The reported coupling factors were compared with the measured insertion loss values for fundamental and harmonic modes over a frequency range from 30 MHz to above 1.0 GHz. On the average a 20-dB increase in insertion loss represented a factor of 10 decrease in coupling factor. Graphical data was developed and applied to estimate the coupling factor values for AlN film layers on silicon substrates under various deposition conditions.
  • Keywords
    aluminium compounds; elemental semiconductors; interdigital transducers; piezoelectric transducers; silicon; substrates; surface acoustic wave couplers; surface acoustic wave transducers; 30 MHz to 1.0 GHz; AlN; SAW coupling factor; Si; harmonic rich split finger IDT; network analyzer measurements; paired IDT insertion loss measurements; paired identical unapodized IDTs; piezoelectric substrate; transducer electrodes; Couplings; Fingers; Insertion loss; Loss measurement; Measurement standards; Piezoelectric transducers; Propagation losses; Rotation measurement; Substrates; Surface acoustic waves;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2002. Proceedings. 2002 IEEE
  • ISSN
    1051-0117
  • Print_ISBN
    0-7803-7582-3
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2002.1193390
  • Filename
    1193390