Micro cooling application on high density memory module

A numerical simulation and two kinds of experiments are conducted to investigate the thermal performance of several kinds of heat spreaders for high power memory modules. For numerical study, the commercial code, Flotherm, is used to model the 1GByte DDR memory module array. The convection heat transfer is analyzed for the memory module array with solid heat spreader under an airflow condition. For the wind runnel experiment, solid plate and block type spreaders are examined to obtain the thermal resistance of conjugate heat transfer of the solid under various airflow conditions. Also, to clarify the thermal characteristics and cooling capacity of liquid heat transport, newly designed liquid cooling devices, such as an embedded heat pipe spreader and vapor chamber with micro-wick structure are proposed and evaluated by the heat transport experiment with a water cold plate under the insulation condition.