Title :
2003 cumulative bibliography of articles on semiconductor thermal measurement, management and modeling
Author :
Siegal, Bernard S.
Author_Institution :
Thermal Eng. Associates Inc., Mountain View, CA, USA
Abstract :
This bibliography provides information on semiconductor thermal characteristics, measurement techniques and results, management techniques, hardware applications, modeling and computational techniques, and other pertinent information.
Keywords :
bibliographies; computational fluid dynamics; integrated circuit measurement; integrated circuit modelling; integrated circuit packaging; semiconductor device measurement; semiconductor device models; semiconductor device packaging; thermal analysis; thermal management (packaging); thermal variables measurement; bibliography; semiconductor thermal characteristics; semiconductor thermal measurement techniques; thermal computational techniques; thermal management; thermal modeling; Bibliographies; Circuits; Electronic packaging thermal management; Microassembly; Microscopy; Plastics; Temperature measurement; Thermal conductivity; Thermal management; Thermal resistance;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2003. Ninteenth Annual IEEE
Print_ISBN :
0-7803-7793-1
DOI :
10.1109/STHERM.2003.1194387
