DocumentCode
393597
Title
The adhesion problem for a microstructure with dimples
Author
Tezuka, Shin-ichirou
Author_Institution
Yokogawa Electr. Corp., Nagano, Japan
Volume
1
fYear
2002
fDate
5-7 Aug. 2002
Firstpage
386
Abstract
In this paper, we discuss an adhesion problem of double clamped beams with some ´dimples´ on the surface. We also derive some formulas for designing the dimensions of the dimples and the length of beams. On beams, the adhesion is dominated by the dimension of the center dimple, and the maximum length of beams which do not adhere to their substrate decreases with the inverse cube of the dimple.
Keywords
adhesion; micromechanical devices; semiconductor device models; surface topography; adhesion problem; center dimple dimension; dimple dimensions design; double clamped beams; maximum beam lengths; microstructure dimples; substrate adhesion; surface micromachined structures; Adhesives; Boundary conditions; Clocks; Fabrication; Microstructure; Wet etching;
fLanguage
English
Publisher
ieee
Conference_Titel
SICE 2002. Proceedings of the 41st SICE Annual Conference
Print_ISBN
0-7803-7631-5
Type
conf
DOI
10.1109/SICE.2002.1195428
Filename
1195428
Link To Document