DocumentCode :
39425
Title :
A Study on Measuring Contact Resistance of Ball Bonds on Thin Metallization
Author :
Laor, Ari ; Herrell, Parker J. ; Mayer, Michael
Author_Institution :
Dept. of Mech. & Mechatron. Eng., Univ. of Waterloo, Waterloo, ON, Canada
Volume :
5
Issue :
5
fYear :
2015
fDate :
May-15
Firstpage :
704
Lastpage :
708
Abstract :
Contact resistance measurement configurations for the evaluation of ball bond reliability on thin metallizations are studied. Samples with symmetrical and asymmetrical four-wire probe configurations are analyzed and compared with a calibrated finite-element model. It is found that the measured contact resistance strongly depends on the geometric placement of the probe wires, and the value closest to the true value is obtained from a probe placement that is opposite and away from high-current-density regions on the metallization. Probes should also be placed as close as possible to the contact interface. Sheet resistance components contributed by intermediate thin metallizations are of the same order of magnitude as the unaged reported RC. Therefore, they are considered. Symmetrical current distributions yield a more homogeneous potential drop across the bond interface being probed, but also capture a larger component of metallization sheet resistance. Experimental samples were aged, and the contact resistance increase was measured. The impacts of various probe placements on the sensed RC were studied.
Keywords :
contact resistance; current density; current distribution; finite element analysis; lead bonding; metallisation; reliability; ball bond reliability; bond interface; calibrated finite-element model; contact interface; contact resistance measurement configuration; four-wire probe configuration; geometric probe wire placement; high-current-density region; metallization sheet resistance; symmetrical current distribution yield; thin metallization; Contact resistance; Electrical resistance measurement; Metallization; Probes; Reliability; Resistance; Wires; Contact resistance; electronic components; electronics packaging; intermetallic; nondestructive testing; reliability; reliability.;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2015.2419981
Filename :
7093139
Link To Document :
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