Monolithically integrated photo-receiver with optical waveguides for future 100-Gbit/s class OEICs

Optical waveguides were monolithically integrated with an OEIC to fabricate an ultra-fast optical interconnection and cost-effective photo-receiver module. Additionally, an on-wafer OE-probing system, which can evaluate the optoelectronic performance of the OEIC without dicing, was developed, and we observed a 40-Gbit/s electronic eye diagram from a 40-Gbit/s optical input signal. After dicing the wafer, we packaged the chips using flip-chip bonding by solder micro-bumps. The optical interconnect on a chip self-aligned to a single-mode fiber fixed on the substrate. We achieved an acceptable loss of less than 1 dB with a passive alignment.