High reliability BGA package improvements on module total cost of ownership

This paper describes mechanical reliability and relative cost comparisons from the system ownership point of view. Total system cost performance of a PTFE based organic ball grid array chip package is compared, on a relative basis, to that obtained with other BGA packages having organic as well as ceramic technologies. Mechanical reliability performance values obtained in common reliability testing are projected to field usage performance, and compared across these various package types. The paper discusses the results for large body sizes and large die sizes, where interesting trends are noted. Considering the various package types and sizes, this study identifies primary assembly (to printed wiring board) costs, on a relative basis, including standard BGA assembly, land grid array with sockets, and column grid array. Combining this assembly data with package reliability projections, a simple guide is provided for the total cost of ownership over a period of time. Further refinement, including system availability and service costs, is discussed.