Title :
An approach for object-oriented cluster-level tests based on UML
Author_Institution :
Dept. of Comput. Sci., Jinan Univ., Guangzhou, China
Abstract :
We proposed a systematic methodology TACLLE for testing object-oriented software at class-and cluster-levels, which has been published in ACM Transactions on Software Engineering and Methodology (vol.10, no.1, p.56-109, 2001). The methodology for cluster-level is based on contract specification for message passing across different classes in the given cluster. Recent years, more and more software developers use UML (Unified Modeling Language) and corresponding visual modeling tools to develop their application software. We discuss how to use our TACCLE methodology to test UML-based software at cluster-level. In UML model, message passing across different classes in a given use case is described by interaction diagram, i.e. sequence diagram or collaboration diagram. A use case corresponds to a luster. We present a set of guidelines to guide the tester to transform the given sequence diagram or collaboration diagram for a given use case into corresponding contract specification CnSp. By means of the CnSp, our TACCLE methodology can be used to test the implementation of the cluster corresponding to the given use case.
Keywords :
message passing; object-oriented methods; object-oriented programming; program testing; software tools; specification languages; ACM transactions; TACLLE methodology; UML; Unified Modeling Language; application software; class-level testing; cluster-level testing; collaboration diagram; contract specification; interaction diagram; message passing; object-oriented cluster-level tests; object-oriented software testing; sequence diagram; software developers; software engineering; visual modeling tools; Application software; Collaboration; Contracts; Message passing; Object oriented modeling; Software engineering; Software testing; Software tools; System testing; Unified modeling language;
Conference_Titel :
Systems, Man and Cybernetics, 2003. IEEE International Conference on
Print_ISBN :
0-7803-7952-7
DOI :
10.1109/ICSMC.2003.1244553