Title :
Electromagnetic simulation of a test board to support system in package testing
Author :
Surbeck, Gregory ; Jackson, C.M.
Author_Institution :
Ditrans Corp., Irvine, CA, USA
Abstract :
A model of a printed circuit board used to test an RF receiver system in package (SiP) is presented. A single 3D EM model can be created for the SMA, printed circuit test board, and package socket mount. The model gives a superior match to measured data compared to a lumped element equivalent circuit. The model provides a full two-port network where a direct measurement cannot be made.
Keywords :
ball grid arrays; ceramic packaging; circuit simulation; computational electromagnetics; printed circuit testing; radio receivers; surface mount technology; two-port networks; 3D model; BGA; RF receiver; SMA; ceramic package; electromagnetic simulation; full two-port network; microstrip trace; model accuracy; package socket mount; printed circuit board model; system in package testing; Calibration; Circuit simulation; Circuit testing; Microstrip; Packaging; Printed circuits; Protection; Radio frequency; Sockets; System testing;
Conference_Titel :
Microwave and Optoelectronics Conference, 2003. IMOC 2003. Proceedings of the 2003 SBMO/IEEE MTT-S International
Print_ISBN :
0-7803-7824-5
DOI :
10.1109/IMOC.2003.1244909
