Title : 
Constant time interval simulation for semiconductor manufacturing
         
        
            Author : 
Miyashita, Kazuo ; Ozaki, Hiroyuki ; Senoh, Kazuyuki ; Matsuo, Hirofumi
         
        
            Author_Institution : 
Nat. Inst. of Adv. Ind. Sci. & Technol., Japan
         
        
        
        
        
        
            Abstract : 
In this paper, we propose an innovative production planning and control methodology, called CONSTIN, and its associated simulation software for large-scale and unstable production environments such as semiconductor manufacturing. CONSTIN presumes to maintain appropriate levels of work-in-process inventory (WIP) and move WIP between processes only at a fixed time interval. Our theoretical analysis shows a clear relationship between WIP levels and the time interval in CONSTIN. Computational experiments using a set of realistic wafer fabrication process data show that CONSTIN simulator is comparable in accuracy to a traditional event-driven simulator and can run much faster than that. Therefore, we conclude that CONSTIN is a promising production planning and control methodology and provides a powerful simulation solution to large scale semiconductor manufacturing processes.
         
        
            Keywords : 
computer aided production planning; digital simulation; electronics industry; production control; semiconductor device manufacture; semiconductor process modelling; stock control; work in progress; constant time interval simulation; production control; production planning; semiconductor manufacturing; wafer fabrication process; work-in-process inventory; Automobile manufacture; Computational modeling; Discrete event simulation; Job shop scheduling; Manufacturing industries; Manufacturing processes; Processor scheduling; Production planning; Semiconductor device manufacture; Virtual manufacturing;
         
        
        
        
            Conference_Titel : 
Emerging Technologies and Factory Automation, 2003. Proceedings. ETFA '03. IEEE Conference
         
        
            Print_ISBN : 
0-7803-7937-3
         
        
        
            DOI : 
10.1109/ETFA.2003.1247729