Title :
Study of the sub-millikelvin thermal control of a frequency reference cavity
Author :
Canuto, Enrico ; Musso, Fabio
Author_Institution :
Dipt. di Autom. e Inf., Politecnico di Torino, Italy
Abstract :
ESA (European Space Agency) scientific missions like GAIA (Global Astrometric Interferometer for Astrophysics) and LISA (Laser Interferometer Space Antenna) require laser interferometry as driving technology. A frequency-stable light radiation is employed as a dimensional standard for very accurate (below 10pm) distance measurements. The wavelength of the light radiation, emitted by a monolithic laser source, must be stabilized against a frequency standard, which should be provided by a Fabry-Perot cavity which is dimensionally stable better than one part over 1012. A cavity of this kind, although made by a thermally stable material, must be thermally stabilized better than 0.1 mK. Moreover, construction must absolutely guarantee the only cause of deformation to be thermo-elastic, in order to make decisive and effective thermal control. The paper presents thermal design of the cavity as well as the digital control guaranteeing thermal stability. Simulated results are encouraging. Cavity construction is under way.
Keywords :
Fabry-Perot interferometers; digital control; distance measurement; frequency standards; light interferometry; thermal stability; thermal variables control; ESA scientific missions; European space agency; Fabry-Perot cavity; cavity thermal design; distance measurements; frequency reference cavity; frequency stable light radiation; global astrometric interferometer for astrophysics; laser interferometer space antenna; laser interferometry; monolithic laser source; submillikelvin thermal control; thermally stable material; wavelength; Astrophysics; Distance measurement; Fabry-Perot; Frequency; Laser stability; Measurement standards; Optical interferometry; Optical materials; Space missions; Space technology;
Conference_Titel :
Emerging Technologies and Factory Automation, 2003. Proceedings. ETFA '03. IEEE Conference
Print_ISBN :
0-7803-7937-3
DOI :
10.1109/ETFA.2003.1247745