Title :
Cross-connect-type wavelength add-drop node with integrated band muxes, interleavers, and monitor
Author :
Doerr, C.R. ; Stulz, L.W. ; Levy, D.S. ; Cappuzzo, M. ; Gomez, L. ; Wong-Foy, A. ; Chen, E. ; Richards, G. ; Pafchek, R. ; Bogert, G.
Author_Institution :
Lucent Technol. Bell Labs., Holmdel, NJ, USA
Abstract :
We integrated a cross-connect-type add-drop, de-interleaver, interleaver, combiner, and variable attenuators on one silica waveguide chip and a band demux, band mux, and optical monitor on another to create a potentially low-startup-cost node.
Keywords :
demultiplexing equipment; integrated optics; optical attenuators; optical communication equipment; optical fibre communication; optical waveguides; silicon compounds; wavelength division multiplexing; SiO2; band demux; cross-connect-type wavelength add-drop node; de-interleaver; integrated band muxes; interleavers; low-startup-cost node; optical combiner; optical fibre communication; optical monitor; optical variable attenuators; silica waveguide chip; Costs; Integrated optics; Monitoring; Optical add-drop multiplexers; Optical attenuators; Optical filters; Optical transmitters; Optical waveguides; Programmable control; Silicon compounds;
Conference_Titel :
Optical Fiber Communications Conference, 2003. OFC 2003
Print_ISBN :
1-55752-746-6
DOI :
10.1109/OFC.2003.1248614
