DocumentCode :
399930
Title :
Emerging technology for backplanes and chip-to-chip interconnects
Author :
Morozov, V.N. ; Guilfoyle, P.S. ; Louderback, D.A.
Author_Institution :
OptiComp Corp., Zephyr Cove, NV, USA
Volume :
1
fYear :
2003
fDate :
27-28 Oct. 2003
Firstpage :
234
Abstract :
A novel approach is developed by Opticomp Corporation (OCC) to achieve reconfigurable optical interconnects. This approach enables high throughput, high switching speed, low latency, protocol independence, scalability, low power dissipation, and monolithic integration. OCC has developed a distributed crossbar switching architecture that provides dynamic reconfigurability, coupled with a natural reduction in latency. A modular implementation of this architecture is well suited for demanding applications such as optical backplanes and chip-to-chip interconnects.
Keywords :
integrated optoelectronics; optical backplanes; optical switches; chip-to-chip interconnects; distributed crossbar switching; monolithic integration; optical backplanes; reconfigurable optical interconnects; Arrayed waveguide gratings; Backplanes; Electromagnetic waveguides; Integrated circuit interconnections; Optical arrays; Optical interconnections; Optical receivers; Optical sensors; Optical waveguides; Planar waveguides;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Lasers and Electro-Optics Society, 2003. LEOS 2003. The 16th Annual Meeting of the IEEE
ISSN :
1092-8081
Print_ISBN :
0-7803-7888-1
Type :
conf
DOI :
10.1109/LEOS.2003.1251722
Filename :
1251722
Link To Document :
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