Title :
Opto-electronics packaging techniques for interconnection
Author :
Kurata, K. ; Hatakeyama, Ichiro ; Miyoshi, Kazunori ; Shimizu, Takanori ; Sasaki, Jun Ichi ; Kurihara, Mitsw ; Yamamoto, Keisuke
Author_Institution :
NEC Corp., Ibaraki, Japan
Abstract :
There is a dilemma in choosing between high density packaging and low loss transmission line. Though the LSI circuit and packaging become high density, the wiring on the printed wire board (PWB) becomes wider over 10 Gbit transmission. This paper introduces opto-electronics packaging techniques which aims to solve the problem of optical interconnection dilemma.
Keywords :
integrated circuit packaging; integrated optoelectronics; optical interconnections; LIS circuit; high density packaging; low loss transmission line; optical interconnection; optoelectronics packaging; printed wire board; Energy consumption; Integrated circuit interconnections; Large scale integration; Optical arrays; Optical buffering; Optical interconnections; Optical receivers; Packaging; Stimulated emission; Wiring;
Conference_Titel :
Lasers and Electro-Optics Society, 2003. LEOS 2003. The 16th Annual Meeting of the IEEE
Print_ISBN :
0-7803-7888-1
DOI :
10.1109/LEOS.2003.1251801
