DocumentCode
399990
Title
Surface mount photonics as a platform for optoelectronic packaging
Author
Vernooy, David W. ; Benzoni, Albert M. ; Blauvelt, Henry A. ; Paslaski, Joel S.
Author_Institution
Xponent Photonics Inc., Monrovia, CA, USA
Volume
1
fYear
2003
fDate
27-28 Oct. 2003
Firstpage
370
Abstract
A planar lightwave circuit (PLC) based optoelectronic packaging platform is described. Features include completely passive, performance-insensitive alignment for all devices to +/- 2 microns, glob-top encapsulation to eliminate hermetic packaging and wafer-level test and burn-in.
Keywords
chip scale packaging; flip-chip devices; integrated optics; integrated optoelectronics; optical interconnections; surface mount technology; glob-top encapsulation; optoelectronic packaging; passive alignment; performance-insensitive alignment; planar lightwave circuit; surface mount photonics; wafer-level burn-in; wafer-level test; Assembly; Costs; Optical devices; Optical fiber devices; Optical fiber polarization; Optical waveguides; Photonics; Programmable control; Semiconductor device packaging; Wafer scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics Society, 2003. LEOS 2003. The 16th Annual Meeting of the IEEE
ISSN
1092-8081
Print_ISBN
0-7803-7888-1
Type
conf
DOI
10.1109/LEOS.2003.1251807
Filename
1251807
Link To Document