Title :
Interface states and related surface currents in SiC junctions
Author :
Codreanu, C. ; Avram, M. ; Obreja, V. ; Voitincu, C. ; Codreanu, I.
Author_Institution :
Nat. Inst. for Res. & Dev. in Microtechnologies, Bucharest, Romania
fDate :
28 Sept.-2 Oct. 2003
Abstract :
In the present work an analytical model for the excess surface currents related to the interface states in SiC junctions is proposed. Four contributions to the current are considered: generation of charge carriers associated with surface states localized at the SiC-SiO2 interface, generation of carriers associated with traps in the depletion layer, the diffusion of carriers in the neutral region near the depletion layer, and the channel effect due to surface charge. The surface charge can cause a surface inversion layer in the low doped region of the diode. In conditions of the reverse bias, a current flows through this region-giving rise to an additionally surface component of the leakage current (surface channel current). Our calculations take into account the incomplete ionization of dopants and use the results of the charge-sheet model for SiC inversion layers. Reported experimental results on surface effects on SiC junctions are considered for the evaluation of the model.
Keywords :
bipolar transistors; interface states; inversion layers; leakage currents; semiconductor device breakdown; semiconductor device models; semiconductor device testing; semiconductor-insulator boundaries; silicon compounds; space charge; surface states; wide band gap semiconductors; SiC junctions; SiC-SiO2; SiC-SiO2 interface; channel effect; charge carriers; charge-sheet model; depletion layer; incomplete ionization; interface states; low doped region; neutral region; reverse bias; surface charge; surface currents; surface inversion layer; traps; Charge carriers; Interface states; Leakage current; P-n junctions; Radiative recombination; Semiconductor diodes; Semiconductor process modeling; Silicon carbide; Space charge; Temperature;
Conference_Titel :
Semiconductor Conference, 2003. CAS 2003. International
Print_ISBN :
0-7803-7821-0
DOI :
10.1109/SMICND.2003.1252439