DocumentCode :
400359
Title :
An ELO-VCSEL tile integrated on CMOS IC with polyimide bonding and nano paste metallization
Author :
Kondo, Taka-Yuki ; Shimoda, Tatsuya ; Kitamura, Shojiro ; Nimura, Yoshihiko ; Kaneko, Takeo
Author_Institution :
Technol. Platform Res. Center, Seiko Epson Corp., Japan
Volume :
2
fYear :
2003
fDate :
27-28 Oct. 2003
Firstpage :
648
Abstract :
In this work, we present results on the monolithically assembly of VCSEL and CMOS IC using epitaxial liftoff (ELO), polyimide bonding and paste metallization. And we also demonstrate results of high frequency driving of the integrated devices.
Keywords :
CMOS integrated circuits; epitaxial growth; integrated circuit bonding; integrated circuit metallisation; integrated optics; monolithic integrated circuits; nanotechnology; surface emitting lasers; CMOS IC; ELO-VCSEL tile; epitaxial liftoff; high frequency driving; integrated device; monolithic assembly; nano paste metallization; polyimide bonding; CMOS integrated circuits; Etching; Frequency; Gallium arsenide; Integrated circuit interconnections; Metallization; Polyimides; Tiles; Vertical cavity surface emitting lasers; Wafer bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Lasers and Electro-Optics Society, 2003. LEOS 2003. The 16th Annual Meeting of the IEEE
ISSN :
1092-8081
Print_ISBN :
0-7803-7888-1
Type :
conf
DOI :
10.1109/LEOS.2003.1252967
Filename :
1252967
Link To Document :
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