DocumentCode
400775
Title
Power-optimal simultaneous buffer insertion/sizing and wire sizing
Author
Li, Ruiming ; Zhou, Dian ; Liu, Jin ; Zeng, Xuan
Author_Institution
Dept. of Electr. Eng., Texas Univ., Dallas, TX, USA
fYear
2003
fDate
9-13 Nov. 2003
Firstpage
581
Lastpage
586
Abstract
This paper studies the problems of minimizing power dissipation of an interconnect wire by simultaneously considering buffer insertion/sizing and wire sizing (BISWS). We consider two cases, namely minimizing power dissipation with optimal delay constraints, and minimizing power dissipation with a given delay penalty. We derive closed form optimal solutions for both cases. These closed form solutions can be used to efficiently estimate the power dissipation in the early stages of the VLSI designs. We observe that the power dissipation can be much different even with the same optimal delay.
Keywords
VLSI; buffer circuits; integrated circuit design; integrated circuit interconnections; low-power electronics; minimisation; BISWS; VLSI designs; buffer insertion; buffer sizing; interconnect wire; optimal delay constraints; optimal solutions; power dissipation; very large scale integration; wire sizing; Application specific integrated circuits; Delay effects; Integrated circuit interconnections; Microelectronics; Permission; Power dissipation; Power engineering and energy; Power engineering computing; Very large scale integration; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Aided Design, 2003. ICCAD-2003. International Conference on
Conference_Location
San Jose, CA, USA
Print_ISBN
1-58113-762-1
Type
conf
DOI
10.1109/ICCAD.2003.159741
Filename
1257869
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