DocumentCode :
40080
Title :
Thermal Loading and Lifetime Estimation for Power Device Considering Mission Profiles in Wind Power Converter
Author :
Ke Ma ; Liserre, Marco ; Blaabjerg, Frede ; Kerekes, Tamas
Author_Institution :
Dept. of Energy Technol., Aalborg Univ., Aalborg, Denmark
Volume :
30
Issue :
2
fYear :
2015
fDate :
Feb. 2015
Firstpage :
590
Lastpage :
602
Abstract :
As a key component in the wind turbine system, the power electronic converter and its power semiconductors suffer from complicated power loadings related to environment, and are proven to have high failure rates. Therefore, correct lifetime estimation of wind power converter is crucial for the reliability improvement and also for cost reduction of wind power technology. Unfortunately, the existing lifetime estimation methods for the power electronic converter are not yet suitable in the wind power application, because the comprehensive mission profiles are not well specified and included. Consequently, a relative more advanced approach is proposed in this paper, which is based on the loading and strength analysis of devices and takes into account different time constants of the thermal behaviors in power converter. With the established methods for loading and lifetime estimation for power devices, more detailed information of the lifetime-related performance in wind power converter can be obtained. Some experimental results are also included to validate the thermal behavior of power device under different mission profiles.
Keywords :
cost reduction; estimation theory; power convertors; power generation reliability; power semiconductor devices; thermal analysis; wind power; wind turbines; cost reduction; high failure rates; lifetime estimation methods; lifetime-related performance; mission profiles; power device; power electronic converter; power loading analysis; power semiconductors; reliability improvement; strength analysis; thermal behavior; thermal loading; wind power converter; wind turbine system; Estimation; Insulated gate bipolar transistors; Load modeling; Loading; Thermal loading; Wind power generation; Wind turbines; IGBT; lifetime prediction; mission profiles; power semiconductor device; thermal cycling; wind power;
fLanguage :
English
Journal_Title :
Power Electronics, IEEE Transactions on
Publisher :
ieee
ISSN :
0885-8993
Type :
jour
DOI :
10.1109/TPEL.2014.2312335
Filename :
6774870
Link To Document :
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