Title :
Advances in optical densitometry for low dose measurements
Author :
Kuzbyt, R. ; Eddy, R. ; White, N.R. ; Callahan, R.
Abstract :
The move to sub 130nm devices has driven the need to have a wafer level, high sensitivity low dose mapping capability for all species on large diameter silicon wafers. Sheet resistance mapping systems do not provide the feature sensitivity and matching capability required for precision 1E11 to 1E13 doses. The new CorMap Optical Densitometry System uses a 595nm LED light source to measure the development of dye in a photo resist polymer. The Core Systems unit bounces the light off of a coated, standard silicon wafer. After the exposure to the ion beam, a very high definition wafer level map is produced in 1 - 2 minutes (for 200mm wafers). This paper will review the areas where the CorMap (Model 200) offers unique applications for process diagnostics and ion implant monitoring for dose, energy and energy/species. Dose and energy sensitivity over a wide range (inc. 2.5 MeV+) of lower doses will be shown and compared.
Keywords :
ion implantation; process monitoring; semiconductor doping; 1 to 2 min; 130 nm; 200 mm; 595 nm; ion implant monitoring; low dose measurements; optical densitometry; photoresist polymer; process diagnostics; sub 130nm devices; wafer level high sensitivity low dose mapping capability; Density measurement; Electrical resistance measurement; Light emitting diodes; Light sources; Optical polymers; Optical sensors; Organic light emitting diodes; Particle beam optics; Resists; Silicon;
Conference_Titel :
Ion Implantation Technology. 2002. Proceedings of the 14th International Conference on
Conference_Location :
Taos, New Mexico, USA
Print_ISBN :
0-7803-7155-0
DOI :
10.1109/IIT.2002.1257983