DocumentCode
400872
Title
Plasma electron flood for a scanned beam implanter
Author
Sano, Makoto ; Kabasawa, Mitsuaki ; Sato, Fumiaki ; Sugitani, M.
fYear
2002
fDate
27-27 Sept. 2002
Firstpage
315
Lastpage
318
Abstract
Recently, charging damage has been observed even in relatively low dose implantation on medium current ion implanters, especially in the case of wafers coated with photoresist patterns. To suppress the charging damage in implantation, a plasma electron flood system has been developed for the medium current ion implanter, NV-MC3, which has an electrostatic beam scanning system and accommodates up to 300mm wafers. The plasma electron flood system has a large size chamber with multi-cusp magnetic fields and supplies electrons for the scanned beam from a long slit to the whole scanning region. An in-situ charge detection system has been also developed to monitor the performance of the flood system. The evaluation results of these systems will be reported below.
Keywords
focused ion beam technology; ion implantation; ion sources; plasma sources; semiconductor doping; 300 mm; charging damage; electrostatic beam scanning system; low dose implantation; medium current ion implanters; multi-cusp magnetic fields; plasma electron flood; scanned beam implanter; wafers coated with photoresist patterns; Electron beams; Electrostatics; Floods; Ion beams; Magnetic confinement; Magnetic fields; Particle beams; Plasmas; Resists; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Ion Implantation Technology. 2002. Proceedings of the 14th International Conference on
Conference_Location
Taos, New Mexico, USA
Print_ISBN
0-7803-7155-0
Type
conf
DOI
10.1109/IIT.2002.1258002
Filename
1258002
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