orig-research

In an ion implant module, the environmental and physical control systems are both costly and highly complex. Both the total cost and the safe operation are high level Issues in the wafer fab environment. An ion implanter utilizes toxic source gas materials (i.e. arsine, phosphine and boron trifluoride). The proper handling of these materials and environmental issues related to safety, focusing on the overall cost effective and cost efficient method of operation are of paramount concern. This paper explores the key aspects of National Semiconductor´s (Arlington, Texas) program for HGM (hazardous gas management) and total strategy using ATMI´s VAC/spl trade/ and SDS/spl reg/ systems. This paper will review aspects and issues with both the VAC package and SDS gas sources in terms of capacity, cost per usable gram, safety, environmental issues and actual performance and potential implanter performance improvements as widely reported within the module.