DocumentCode :
400909
Title :
Characterization and environmental impact of plasma products within an ion implanter
Author :
Zarrug, H. ; Mefo, J. ; Sealy, B. ; Boudreault, G. ; Jeynes, C. ; Webb, R.P. ; Kirkby, K.J. ; Collart, E.J.H.
fYear :
2002
fDate :
27-27 Sept. 2002
Firstpage :
471
Lastpage :
474
Abstract :
The way in which the plasma in the ion source interacts with the constituent elements of the source chamber can provide important insights into the plasma chemistry and may facilitate improvements in ion source design and operation. It is also an important parameter in determining the environmental impact of the implantation process. It is worth noting that less than 0.4% of the material placed into the ion source is actually implanted as a dopant into the target wafers; the rest remains as a solid residue or gaseous emission. As many of the materials used for dopant implantation are either highly toxic, pyrophoric, greenhouse gases or powerful ozone depleters, or combinations of the above it is imperative, that the extent, location and chemical composition of these residues are quantified and understood. This will enable their impact on the environment, economy and society, the three pillars of sustainable development to be assessed. In this study small pieces of silicon were placed at predetermined points within the source chamber of a commercial ion implantation system. Antimony was then run using SbF3 as the feed gas. At the end of the run the silicon samples were retrieved and analysed using Rutherford Backscattering (RBS) and ion channelling. It was found that the location of the samples influenced the elemental composition of the plasma products deposited in the source chamber. A similar experiment was also conducted for BF2+ implants using a BF3 feed gas, again the elemental composition varied with the position of the silicon samples allowing the distribution of different elements, within the plasma products, to be mapped around the source chamber.
Keywords :
Rutherford backscattering; channelling; environmental factors; ion implantation; plasma sources; semiconductor doping; BF3; Rutherford Backscattering; SbF3; Si; chemical composition; environmental impact; extent; gaseous emission; greenhouse gases; highly toxic; ion channelling; ion implanter; ion source design; ion source operation; location; ozone depleters; plasma chemistry; plasma products; pyrophoric; solid residue; Chemical elements; Composite materials; Feeds; Global warming; Ion sources; Plasma chemistry; Plasma immersion ion implantation; Plasma sources; Silicon; Solids;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ion Implantation Technology. 2002. Proceedings of the 14th International Conference on
Conference_Location :
Taos, New Mexico, USA
Print_ISBN :
0-7803-7155-0
Type :
conf
DOI :
10.1109/IIT.2002.1258043
Filename :
1258043
Link To Document :
بازگشت