• DocumentCode
    400919
  • Title

    Optimizing implanter vacuum performance with various cassette materials

  • Author

    Evans, M. ; O´Neil, Jason ; Komma, B.

  • fYear
    2002
  • fDate
    27-27 Sept. 2002
  • Firstpage
    511
  • Lastpage
    514
  • Abstract
    IC manufacturers will often adopt new cassette materials for particulate control, dimensional stability, and improved thermal properties. In order to maintain tool performance, in some cases the introduction of these new materials introduce new demands on the vacuum system. Six cassette materials have been tested in a medium current implanter using eight pump configurations. The results show that preventing water in the load lock from getting to the process chamber is important to maximize tool throughput. This paper discusses what options are currently available to compensate for new vacuum demands that are related to hygroscopic cassette materials.
  • Keywords
    integrated circuit manufacture; ion implantation; vacuum techniques; IC manufacturers; cassette materials; dimensional stability; load lock; medium current implanter; optimizing implanter vacuum performance; particulate control; process chamber; pump configurations; thermal properties; tool performance; tool throughput; vacuum system; Implants; Materials testing; Production; Resists; Semiconductor device manufacture; Semiconductor materials; Thermal stability; Throughput; Vacuum systems; Valves;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ion Implantation Technology. 2002. Proceedings of the 14th International Conference on
  • Conference_Location
    Taos, New Mexico, USA
  • Print_ISBN
    0-7803-7155-0
  • Type

    conf

  • DOI
    10.1109/IIT.2002.1258054
  • Filename
    1258054