DocumentCode :
400919
Title :
Optimizing implanter vacuum performance with various cassette materials
Author :
Evans, M. ; O´Neil, Jason ; Komma, B.
fYear :
2002
fDate :
27-27 Sept. 2002
Firstpage :
511
Lastpage :
514
Abstract :
IC manufacturers will often adopt new cassette materials for particulate control, dimensional stability, and improved thermal properties. In order to maintain tool performance, in some cases the introduction of these new materials introduce new demands on the vacuum system. Six cassette materials have been tested in a medium current implanter using eight pump configurations. The results show that preventing water in the load lock from getting to the process chamber is important to maximize tool throughput. This paper discusses what options are currently available to compensate for new vacuum demands that are related to hygroscopic cassette materials.
Keywords :
integrated circuit manufacture; ion implantation; vacuum techniques; IC manufacturers; cassette materials; dimensional stability; load lock; medium current implanter; optimizing implanter vacuum performance; particulate control; process chamber; pump configurations; thermal properties; tool performance; tool throughput; vacuum system; Implants; Materials testing; Production; Resists; Semiconductor device manufacture; Semiconductor materials; Thermal stability; Throughput; Vacuum systems; Valves;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ion Implantation Technology. 2002. Proceedings of the 14th International Conference on
Conference_Location :
Taos, New Mexico, USA
Print_ISBN :
0-7803-7155-0
Type :
conf
DOI :
10.1109/IIT.2002.1258054
Filename :
1258054
Link To Document :
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