DocumentCode
400919
Title
Optimizing implanter vacuum performance with various cassette materials
Author
Evans, M. ; O´Neil, Jason ; Komma, B.
fYear
2002
fDate
27-27 Sept. 2002
Firstpage
511
Lastpage
514
Abstract
IC manufacturers will often adopt new cassette materials for particulate control, dimensional stability, and improved thermal properties. In order to maintain tool performance, in some cases the introduction of these new materials introduce new demands on the vacuum system. Six cassette materials have been tested in a medium current implanter using eight pump configurations. The results show that preventing water in the load lock from getting to the process chamber is important to maximize tool throughput. This paper discusses what options are currently available to compensate for new vacuum demands that are related to hygroscopic cassette materials.
Keywords
integrated circuit manufacture; ion implantation; vacuum techniques; IC manufacturers; cassette materials; dimensional stability; load lock; medium current implanter; optimizing implanter vacuum performance; particulate control; process chamber; pump configurations; thermal properties; tool performance; tool throughput; vacuum system; Implants; Materials testing; Production; Resists; Semiconductor device manufacture; Semiconductor materials; Thermal stability; Throughput; Vacuum systems; Valves;
fLanguage
English
Publisher
ieee
Conference_Titel
Ion Implantation Technology. 2002. Proceedings of the 14th International Conference on
Conference_Location
Taos, New Mexico, USA
Print_ISBN
0-7803-7155-0
Type
conf
DOI
10.1109/IIT.2002.1258054
Filename
1258054
Link To Document