Title :
A low latency handoff scheme using positional information for mobile IP based networks
Author :
Bandai, Masaki ; Sasase, Iwao
Author_Institution :
Dept. of Inf. & Comput. Sci., Keio Univ., Kanagawa, Japan
Abstract :
In order to realize low handoff latency without increasing overhead in wired channel, we propose a handoff scheme using positional information for mobile IP based networks. In the proposed scheme, foreign agents (FA) exchange IP addresses and positional information. When a distance between FA and mobile host (MH) exceeds a threshold, FA copies packets and forwards them only to MH´s next FA. Moreover, in order for MH to receive first advertisement (ADV) message earlier, the transmission interval of ADV message is shortened in next FA. By shortening transmission interval of ADV message, MH can receive forwarded packets earlier. In addition, when new FA receives registration request (REQ) message from MH, FA replies tentative registration (TREG) message to MH. Adding tentative registration, MH can begin receiving forwarded packets without waiting for receiving registration reply (REP) message from home agent (HA). By performance evaluation using both theoretical analysis and computer simulations, we show that the proposed scheme can realize low handoff latency without increasing overhead in both wired and wireless channel.
Keywords :
IP networks; Internet; mobile agents; mobile computing; packet radio networks; IP addresses; computer simulations; first advertisement message; foreign agents; home agent; low latency handoff scheme; mobile IP based networks; mobile host; packets; positional information; receiving registration reply message; registration request message; tentative registration message; theoretical analysis; wired channel; wireless channel; Birth disorders; Computer science; Computer simulation; Delay; Doped fiber amplifiers; Global Positioning System; Internet; Mobile computing; Performance analysis; Protocols;
Conference_Titel :
Global Telecommunications Conference, 2003. GLOBECOM '03. IEEE
Print_ISBN :
0-7803-7974-8
DOI :
10.1109/GLOCOM.2003.1258879