A power amplifier module with fully embedded passive components in a LTCC substrate for K-PCS band mobile phone

Author

Kim, Erick ; Lee, Young-Shin ; Chan-Sei Yoo ; Lee, Woo-Seong ; Park, Jong-Cheol

Author_Institution

High Frequency Mater. Res. Center, Korea Electron. Technol. Inst., Kyunggi-Do, South Korea

Volume

1

fYear

2003

fDate

7-9 Oct. 2003

Firstpage

253

Abstract

Use of accurate circuit models for embedded RF passive components in LTCC (low temperature co-fired ceramics) provides a way to efficiently design high performance RF modules. In this study, in order to increase the accuracy of circuit models, the library of components was developed and the parasitic components were extracted. With the circuit model, the PAM (power amplifier module) was developed using the LTCC process. The module was fabricated with fully embedded passive components within a compact 6×6×1.2 mm size, and it exhibited power performance sufficient for K-PCS band mobile phones.

Keywords

UHF power amplifiers; cellular radio; ceramic capacitors; ceramic packaging; circuit CAD; circuit simulation; mobile handsets; personal communication networks; thin film inductors; thin film resistors; 1.2 mm; 6 mm; K-PCS band mobile phone; LTCC process; LTCC substrate; RF module design; RF passive components; circuit models; components library; fully embedded passive components; low temperature co-fired ceramics; parasitic components; power amplifier module; power performance; Capacitors; Ceramics; Circuits; Dielectric constant; Dielectric substrates; Electrodes; Libraries; Mobile handsets; Power amplifiers; Radio frequency;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference, 2003. 33rd European

Print_ISBN

1-58053-834-7

Type

conf

DOI

10.1109/EUMC.2003.1262267

Filename

1262267