Vertical feedthroughs for millimeter-wave LTCC modules

Author

Heyen, Johann ; Gordiyenko, Andriy ; Heide, Patric ; Jacob, Arne F.

Author_Institution

Inst. fur Hochfrequenztech., Technische Univ. Braunschweig, Germany

Volume

1

fYear

2003

fDate

7-9 Oct. 2003

Firstpage

411

Abstract

This paper reports on novel types of vertical interconnects to be incorporated inside highly integrated LTCC Modules (Low Temperature Co-fired Ceramics). RF-transitions vertically interconnecting the top and bottom side of the LTCC are studied using alternatively CPW (coplanar waveguide) or microstrip feedlines. Vertical DC supply and control lines with integrated RF blocking capacitors are also demonstrated. LTCC test modules were fabricated and the performance of all feedthroughs successfully validated by scattering parameter measurements up to 40 GHz.

Keywords

MIMIC; S-parameters; ceramic packaging; coplanar waveguides; microstrip transitions; multichip modules; 3D integration; 40 GHz; BGA interface; CPW feedlines; RF transitions; integrated blocking capacitors; microstrip feedlines; millimeter-wave LTCC modules; multichip modules; scattering parameters; vertical feedthroughs; vertical interconnects; Coplanar waveguides; Dielectric substrates; Integrated circuit interconnections; Integrated circuit packaging; MMICs; Microstrip; Millimeter wave technology; RF signals; Radio frequency; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference, 2003. 33rd European

Print_ISBN

1-58053-834-7

Type

conf

DOI

10.1109/EUMC.2003.1262309

Filename

1262309