A novel approach for LTCC packaging using a PBG structure for shielding and package mode suppression

Author

Ziroff, Andreas ; Nalezinski, Martin ; Menze, Wolfgang

Author_Institution

Siemens AG, Munich, Germany

Volume

1

fYear

2003

fDate

7-9 Oct. 2003

Firstpage

419

Abstract

A packaging solution for multifunctional modules up to an operating frequency of 50 GHz based on Low Temperature Cofired Ceramics (LTCC) is presented in this paper. A Ball Grid Array (BGA) as well as a Land Grid Array (LGA) transition from Printed Circuit Board (PCB) into a surface mounted module are proposed. They use a Photonic Bandgap (PBG) structure to suppress the excitation of parasitic modes e.g. by the SMT interconnect. This approach provides process tolerant transitions as well as it allows the integration of wave guide structures in buried layers. This measure provides a greater flexibility in the design of microwave circuits and a major potential for miniaturisation of microwave subsystems.

Keywords

ball grid arrays; ceramic packaging; electromagnetic shielding; microwave circuits; microwave photonics; millimetre wave circuits; modules; photonic band gap; surface mount technology; 50 GHz; LTCC packaging; PCB; ball grid array transition; buried layers; compact multifunctional module; dispersion relation; eigenvalue problem; land grid array transition; low cost ceramic substrate; microwave circuits; multifunctional modules; one-dimensional model; package mode suppression; parasitic modes; photonic bandgap structure; process tolerant transitions; shielding; surface mounted module; Ceramics; Electronics packaging; Frequency; Integrated circuit interconnections; LAN interconnection; Land surface; Land surface temperature; Photonic band gap; Printed circuits; Surface-mount technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference, 2003. 33rd European

Print_ISBN

1-58053-834-7

Type

conf

DOI

10.1109/EUMC.2003.1262311

Filename

1262311