Investigation of Si IGBT Operation at 200 $,{}^\circ$ C for Traction Applications

In order to satisfy the high-density requirement and harsh thermal conditions while reducing cost in future electric and hybrid electric vehicles (HEV), a systematic study of a 1200-V trench-gate field-stop Si insulated gate bipolar transistor (IGBT) operating up to 200°C is performed to determine its feasibility, issues, and application guideline. The device forward conduction characteristics, leakage current, and switching performance are evaluated at various temperatures. Based on the device characterization, the impact of the increased junction temperature on a traction drive converter loss and thermal management is analyzed. It is shown that by extending the device junction temperature to 200°C, the additional 65°C coolant loop can be eliminated without compromising power density and thermal management design. Furthermore, the possible failure mechanisms including latching, short circuit fault, and avalanche capability are tested at elevated temperatures. The criteria considering thermal stability, thermal management, short circuit capability, and avalanche capability are given at 200°C to ensure the safe and reliable operation of Si IGBTs.