DATE panel chips of the future: soft, crunchy or hard?

Author

Paulin, Pierre G.

Author_Institution

Central R&D, STMicroelectron., Ottawa, Ont., Canada

Volume

2

fYear

2004

fDate

16-20 Feb. 2004

Firstpage

844

Abstract

Today´s electronic products are composed of an increasingly diverse set of ICs, ranging from dedicated ASICs, domain-specific ASSPs, platform FPGAs, to general-purpose FPGA´s. With increasing integration, a mix of different fabrics on a single SoC becomes possible, combining ASIC-style standard cells, embedded FPGAs, mask-programmable sea-of-gates, and programmable processors. The panelists will present their vision of the fabric which will dominate SoCs in 90 nm technologies and beyond, based on industrial trends and case studies. They will also outline the key CAD tool challenges for the chosen fabric.

Keywords

application specific integrated circuits; electronic products; field programmable gate arrays; nanotechnology; system-on-chip; 90 nm; 90 nm technology; ASIC; CAD tool; SoC; application specific integrated circuit; application specific standard product; domain specific ASSP; electronic products; field programmable gate array; general purpose FPGA; mask programmable sea-of-gates; platform FPGA; programmable processors; Application specific processors; Costs; Design automation; Fabrics; Field programmable gate arrays; Manufacturing; Productivity; Reduced instruction set computing; Space technology; Time to market;

fLanguage

English

Publisher

ieee

Conference_Titel

Design, Automation and Test in Europe Conference and Exhibition, 2004. Proceedings

ISSN

1530-1591

Print_ISBN

0-7695-2085-5

Type

conf

DOI

10.1109/DATE.2004.1268990

Filename

1268990