• DocumentCode
    403597
  • Title

    Nanometer design: what are the requirements for manufacturing test?

  • Author

    Rajski, Janusz ; Thapar, Kan

  • Author_Institution
    Mentor Graphics Corp., Beaverton, OR, USA
  • Volume
    2
  • fYear
    2004
  • fDate
    16-20 Feb. 2004
  • Firstpage
    930
  • Abstract
    Nanometer technology enables manufacturing of very large SoC designs that have many cores originating from a variety of sources. The challenge here is to integrate different test solutions provided by suppliers of those cores into one comprehensive chip level test. The principal requirement is to reduce the cost of manufacturing test. The DFT methodologies requirement supports high-quality low-cost manufacturing test. The low cost ATE is used for reducing mixed signal test cost. The new fault structures that require detection is done by ATPG engines for test generation and diagnosis.
  • Keywords
    automatic test equipment; automatic test pattern generation; cost reduction; design for testability; fault diagnosis; integrated circuit testing; system-on-chip; ATE; ATPG; DFT; SOC designs; automatic test equipment; automatic test pattern generation; chip level test; cores; cost reduction; design for testability; fault structures; integrated circuit design; manufacturing test; nanometer technology; system-on-chip; Bridge circuits; Circuit testing; Delay effects; Design for testability; Europe; Foundries; Graphics; Manufacturing processes; Process design; Shipbuilding industry;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Automation and Test in Europe Conference and Exhibition, 2004. Proceedings
  • ISSN
    1530-1591
  • Print_ISBN
    0-7695-2085-5
  • Type

    conf

  • DOI
    10.1109/DATE.2004.1269010
  • Filename
    1269010