DocumentCode :
403597
Title :
Nanometer design: what are the requirements for manufacturing test?
Author :
Rajski, Janusz ; Thapar, Kan
Author_Institution :
Mentor Graphics Corp., Beaverton, OR, USA
Volume :
2
fYear :
2004
fDate :
16-20 Feb. 2004
Firstpage :
930
Abstract :
Nanometer technology enables manufacturing of very large SoC designs that have many cores originating from a variety of sources. The challenge here is to integrate different test solutions provided by suppliers of those cores into one comprehensive chip level test. The principal requirement is to reduce the cost of manufacturing test. The DFT methodologies requirement supports high-quality low-cost manufacturing test. The low cost ATE is used for reducing mixed signal test cost. The new fault structures that require detection is done by ATPG engines for test generation and diagnosis.
Keywords :
automatic test equipment; automatic test pattern generation; cost reduction; design for testability; fault diagnosis; integrated circuit testing; system-on-chip; ATE; ATPG; DFT; SOC designs; automatic test equipment; automatic test pattern generation; chip level test; cores; cost reduction; design for testability; fault structures; integrated circuit design; manufacturing test; nanometer technology; system-on-chip; Bridge circuits; Circuit testing; Delay effects; Design for testability; Europe; Foundries; Graphics; Manufacturing processes; Process design; Shipbuilding industry;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Automation and Test in Europe Conference and Exhibition, 2004. Proceedings
ISSN :
1530-1591
Print_ISBN :
0-7695-2085-5
Type :
conf
DOI :
10.1109/DATE.2004.1269010
Filename :
1269010
Link To Document :
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