DocumentCode
403597
Title
Nanometer design: what are the requirements for manufacturing test?
Author
Rajski, Janusz ; Thapar, Kan
Author_Institution
Mentor Graphics Corp., Beaverton, OR, USA
Volume
2
fYear
2004
fDate
16-20 Feb. 2004
Firstpage
930
Abstract
Nanometer technology enables manufacturing of very large SoC designs that have many cores originating from a variety of sources. The challenge here is to integrate different test solutions provided by suppliers of those cores into one comprehensive chip level test. The principal requirement is to reduce the cost of manufacturing test. The DFT methodologies requirement supports high-quality low-cost manufacturing test. The low cost ATE is used for reducing mixed signal test cost. The new fault structures that require detection is done by ATPG engines for test generation and diagnosis.
Keywords
automatic test equipment; automatic test pattern generation; cost reduction; design for testability; fault diagnosis; integrated circuit testing; system-on-chip; ATE; ATPG; DFT; SOC designs; automatic test equipment; automatic test pattern generation; chip level test; cores; cost reduction; design for testability; fault structures; integrated circuit design; manufacturing test; nanometer technology; system-on-chip; Bridge circuits; Circuit testing; Delay effects; Design for testability; Europe; Foundries; Graphics; Manufacturing processes; Process design; Shipbuilding industry;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Automation and Test in Europe Conference and Exhibition, 2004. Proceedings
ISSN
1530-1591
Print_ISBN
0-7695-2085-5
Type
conf
DOI
10.1109/DATE.2004.1269010
Filename
1269010
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