Title :
Layer design for GaAs-based DHBTs enabling 28 V high-power microwave applications
Author :
Maassdorf, Andre ; Kurpas, P. ; Doser, W. ; Brunner, F. ; Bergunde, T. ; Blanck, H. ; Wurfl, Joachim ; Weyers, M. ; Trankle, G.
Author_Institution :
Ferdinand-Braun-Inst. fur Hochstfrequenztechnik, Berlin, Germany
Abstract :
We report on the realization of GaAs-based double heterojunction bipolar transistors (DHBTs) using GaInP as collector material. With a collector thickness of 1.5 /spl mu/m we achieved up to 70 V base-collector breakdown voltage. We used a GaAs spacer in conjunction with a highly doped n-type layer at the base-collector junction to compensate the reduction of the critical current density due to the base-collector heterojunction. The devices show a DC current gain around 30 and proved to be very stable under on-wafer DC conditions, i.e. we were able to obtain a dissipated power of up to 7.5 W and collector currents up to 1 A on a 4000 /spl mu/m/sup 2/ area device. Regarding high-frequency behavior, the DHBTs exhibit cut-off frequencies up to 30 GHz, which are higher than that of a comparable SHBT (20 GHz). On-wafer load-pull measurements yielded 5 W of microwave output power for a 1680 /spl mu/m/sup 2/ area device at 26 V bias and 2 GHz.
Keywords :
III-V semiconductors; current density; doping profiles; gallium arsenide; gallium compounds; heavily doped semiconductors; heterojunction bipolar transistors; indium compounds; microwave bipolar transistors; semiconductor device measurement; stability; 1 A; 1.5 micron; 2 GHz; 20 GHz; 26 V; 28 V; 30 GHz; 5 W; 7.5 W; 70 V; DC current gain; GaAs spacer; GaAs-based DHBT; GaAs-based double heterojunction bipolar transistors; GaInP collector material; GaInP-GaAs; base-collector breakdown voltage; base-collector heterojunction; base-collector junction; collector currents; collector thickness; critical current density; cut-off frequencies; device area; device bias; dissipated power; high-frequency behavior; high-power microwave applications; highly doped n-type layer; layer design; microwave output power; on-wafer DC conditions; on-wafer load-pull measurements; Critical current density; Cutoff frequency; Doping; Double heterojunction bipolar transistors; Gallium arsenide; Heterojunction bipolar transistors; Lithography; Microwave devices; Power amplifiers; Semiconductor materials;
Conference_Titel :
Electron Devices Meeting, 2003. IEDM '03 Technical Digest. IEEE International
Conference_Location :
Washington, DC, USA
Print_ISBN :
0-7803-7872-5
DOI :
10.1109/IEDM.2003.1269347