• DocumentCode
    40420
  • Title

    LTCC Multilayered Substrate-Integrated Waveguide Filter With Enhanced Frequency Selectivity for System-in-Package Applications

  • Author

    Kuo-Sheng Chin ; Chih-Chun Chang ; Cheng-Hua Chen ; Zengxu Guo ; Wang, Desong ; Wenquan Che

  • Author_Institution
    Dept. of Electron. Eng., Chang Gung Univ., Taoyuan, Taiwan
  • Volume
    4
  • Issue
    4
  • fYear
    2014
  • fDate
    Apr-14
  • Firstpage
    664
  • Lastpage
    672
  • Abstract
    This paper presents a cross-coupled bandpass filter with stacked substrate-integrated waveguide cavities on low-temperature cofired ceramic substrates. The proposed filter has a local multipoint distribution service band with a novel same-side-feed input/output structure. Conventionally, a cross-coupled structure generates only a single pair of transmission zeros. The proposed filter can generate two pairs of transmission zeros beside the passband, thereby providing an excellent cutoff rate in the stopband and improved frequency selectivity. The additional pair of transmission zeros is created by the same-side-feed structure, which constructs an additional source-load coupling path without increasing the circuit size. A multipath coupling diagram is used to illustrate the conformation of the second pair of transmission zeros and predict its behavior. The experimental filter exhibits responses centered at 27.95 GHz with an insertion loss of -2.8 dB, and a bandwidth of 9%. Two pairs of transmission zeros (at 26.3 and 29.6 GHz, and at 23.2 and 37 GHz) around the passband were obtained, achieving excellent selectivity and a wide stopband.
  • Keywords
    band-pass filters; ceramic packaging; microwave filters; substrate integrated waveguides; system-in-package; waveguide filters; cross-coupled bandpass filter; cross-coupled structure; cutoff rate; frequency 23.2 GHz; frequency 26.3 GHz; frequency 27.95 GHz; frequency 29.6 GHz; frequency 37 GHz; frequency selectivity; local multipoint distribution service band; loss -2.8 dB; low-temperature cofired ceramic substrates; multipath coupling diagram; novel same-side-feed input-output structure; passband; source-load coupling path; stacked substrate-integrated waveguide cavities; stopband; system-in-package applications; transmission zeros; Apertures; Cavity resonators; Couplings; Filtering theory; Passband; Q-factor; Substrates; Cross-coupled filter; Ka-band; local multipoint distribution service (LMDS) band; low-temperature cofired ceramic (LTCC) filter; substrate-integrated waveguide (SIW);
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2013.2294720
  • Filename
    6693732